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On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2 - Fukushima - 2020 - Journal of Polymer
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shows the cross-sectional morphology of the multilayer TiN/Al 2 O 3... | Download Scientific Diagram
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Multiscale Modeling in Chemical Vapor Deposition Processes: Models and Methodologies | SpringerLink